New Low Loss Glass
Modular Photonics signs license deal for new low loss glass. This represents a strategic step for the company as it is the first glass to be purpose engineered for laser written 3D integrated photonic chips.
Modular Photonics signs license deal for new low loss glass. This represents a strategic step for the company as it is the first glass to be purpose engineered for laser written 3D integrated photonic chips.
Modular Photonics will be showcasing its hyperscale data centre products at the Australia Pavilion of the Taiwan Smart City Summit and Expo, March 22-25. Our thanks to Austrade Taipei for this unique opportunity!