The mask-less process enables rapid prototyping of high-performance photonic circuits. It can be scaled from small prototyping runs of individual circuits to fabricate entire wafers full of circuits. Modular Photonics’ services encompass the design, fabrication, testing and packaging of photonic circuits.
Rapid Turnaround
Custom Design & Fabrication
3D Waveguide Circuits
Modular Photonics’ proprietary laser inscription process allows for the creation of 3D photonic circuits in glass circuits – suited to a variety of custom PIC applications.
Modular Photonics’ process is entirely mask-less. Designs created on a computer can be realised with the click of a button. This enables rapid iteration between design and testing to refine the circuit and the circuit’s performance. As a result, the customer is faster to market and it keeps the development costs low.
There is no capital expenditure for a mask and the throughput of the fabrication process results in low complexity circuits being fabricated within a few seconds. Yet, the process can be seamlessly scaled to fabricate entire glass wafers of photonic circuits.
Modular Photonics is vertically integrated. It can rely on a team of specialists for designing, fabricating and testing of photonic circuits. Moreover, Modular Photonics has a proven platform for packaging photonic circuits and can pigtail the devices to single-mode, few-mode and multi-mode fibres and fibre arrays as well as polarization maintaining fibres.
The 3-dimensional freedom of Modular Photonics’ process avoids waveguide crossovers. Unlike lithography, it also enables photonic circuits that simultaneously contain single-mode as well as multi-mode waveguides or circuits that feature waveguides which are specifically optimised for different wavelengths. It also facilitates the scalable fabrication of inherent 3D photonic devices, such as photonic lanterns.
